LBTX-202A Small-Scale Diamond Wire Cutting Machine for Material Thin Sheets
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Description
Product Introduction:
The compact diamond wire saw is specifically designed for materials researchers, enabling precision cutting of brittle material samples. Examples include crystals, ceramics, glass, honeycomb ceramics (used as automotive exhaust‑treatment substrates—thin‑walled and fragile), metals, plastics, PCBs, rock and mineral specimens, refractory materials, construction materials, dental materials, and bio‑inspired composite materials. When used for ultra‑thin, precision slicing, it can produce slices as thin as 0.08 mm.
It can be used for cutting materials of varying hardness, particularly well-suited for slicing brittle, cleavable crystals; it is easy to operate and delivers excellent machining quality; its aluminum‑profile frame is both aesthetically pleasing and lightweight.
Technical Specifications:
| Parameter item | Specific parameters |
| Power supply voltage | 220V 50Hz |
| Spindle speed | Adjustable between 2 rpm and 260 rpm. |
| Total length of cutting lines | 20m |
| Inner spacing of the two guide wheels | 100mm |
| Y-axis travel | ≤50mm |
| Z-axis travel | ≤60mm |
| Two-dimensional fixture | Horizontal rotation: 0–360°; left-right tilt angle: ±15° |
| Cargo platform dimensions | 80mm×51mm |
| Maximum workpiece size for cutting | ∅50mm×50mm |
| Maximum cutting depth | 50mm |
| Equipment dimensions | 414mm×500mm×750mm |
| Equipment weight | 40kg |
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LBTX-202A Small-Scale Diamond Wire Cutting Machine for Material Thin Sheets