Silica suspension grinding and polishing fluid for metallographic sample preparation
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Description
Product Introduction:
When certain softer, tougher specimens require final polishing to achieve the desired results, an oxide‑based suspension polishing slurry should be used.
Technical Specifications:
| Name | Description | Granularity | Packaging (bottle) |
| Silica suspension grinding and polishing slurry | Mechanical/chemical polishing, using a liquid silica suspension at pH 9.5, is employed for the final polishing of high-purity metals and alloys, minerals, ceramics, and polymers. Usage: Apply directly to grind and polish high‑gloss surfaces on a wide range of ferrous and non‑ferrous metals, ceramics, composite materials, as well as gemstones, instruments, optical glass, and other products. |
0.04 μm | 500ml |
Mechanical/chemical polishing, using a liquid silica suspension at pH 10 for rapid final polishing of all materials. Usage: Apply directly to grind and polish high‑finish surfaces on a wide range of ferrous and non‑ferrous metals, ceramics, composite materials, as well as gemstones, precision instruments, optical glass, and other similar products. Used for grinding and polishing high‑finish surfaces on various ferrous and non‑ferrous metals, ceramics, composite materials, and products such as gemstones, instruments, and optical glass. |
0.02 μm | 500ml | |
Mechanical/chemical polishing, colloidal silica suspension, pH 10 Used for the final polishing of products requiring high precision. Usage: Dilute with water at a ratio of 1:3 or use with a water-based lubricant. |
0.04 μm | 500ml | |
| 0.02 μm | 500ml |
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Keywords:
Silica suspension grinding and polishing fluid for metallographic sample preparation