SYA-32A Heat Flux Method Multifunctional Thermal Conductivity and Thermal Resistance Testing Instrument
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Description
Product Introduction:
This instrument is primarily used to measure the thermal resistance of thin materials such as thermal conductors, thermally conductive silicone sheets, thermally conductive resins, plastics, rubbers, aluminum substrates, graphene, beryllium oxide ceramics, and alumina ceramics, as well as the contact thermal resistance at solid interfaces and the thermal conductivity of these materials. The test samples are typically solid, sheet‑like specimens; with an appropriate frame, powdered or paste‑like materials can also be tested.
Product Features:
- A protective thermal shield has been added around the test rod inside the testing head (this device provides thermal protection for the specimen), thereby extending the instrument’s temperature measurement range and reducing the influence of ambient temperature on the test results.
- A thermocouple array for measuring temperature differences in the thermal‑flux test has been added to the test rod inside the test head, enhancing the resolution, accuracy, and repeatability of thermal‑flux measurements.
- The use of an ice–water mixture for thermocouple cold-junction compensation has been eliminated, simplifying operation and enhancing user convenience.
- Experimental methods such as “aging reliability testing,” “high‑thermal‑conductivity material testing,” and “inter‑sample contact thermal resistance testing” have been added.
Technical Specifications:
| Main Parameters | Parameter content | |
| 1. Temperature range | 1. 20–80°C (Hot end: room temperature–100.00°C; Cold end: 0–80.00°C, constant-temperature bath) | |
| Note: The temperature range refers to the range of the test sample’s average temperature (the hot‑side and cold‑side temperatures), with the hot‑side temperature slightly lower than the hot‑plate temperature and the cold‑side temperature slightly higher than the cold‑plate temperature. | ||
| 2. Thermal conductivity | 1. Normal mode: 0.1–45 W/m·K | |
| 2. High‑thermal‑conductivity mode: 5–500 W/m·K (requires optional high‑thermal‑conductivity test module) | ||
| 3. Thermal Resistance Range | 0.05–500 (cm²·K/W) | |
| 4. Test Accuracy | 1. Thermal resistance testing: 10–500 cm²·K/W, with an error of ≤3%; 0.05–10 cm²·K/W, with an error of ≤5%. | |
| 2. Thermal conductivity testing: 0.1–5 W/m·K, with an error of ≤3%; 5–500 W/m·K, with an error of ≤5%. | ||
| 3. Thermal contact resistance test: Error ≤ 5% | ||
| 4. Thermal resistance testing of aluminum-based substrates (composite panels): Error ≤ 5% ± 0.1 | ||
| 5. Test head dimensions | Φ30mm | |
| 6. Specimen Dimensions | 1. 0.1–5 W/m·K or 10–500 cm²·K/W, Φ30 × (0.2–5) mm, with stackable thickness options. | |
| 2. 5–45 W/m·K or 2–10 cm²·K/W, (Φ20–Φ30) × (0.2–15) mm | ||
| 3. 5–500 W/m·K, (Φ10–Φ30) × (15–30) mm (high‑thermal‑conductivity mode) | ||
| 4. Aluminum substrate: 15×15 (mm) | ||
| Note: The dimensions of this specimen are nominal; refer to the following instructions for detailed specimen preparation dimensions. | ||
| 7. Pressure Measurement | 0–1000.0 N | |
| 8. Displacement Measurement | 0–40.00 mm | |
| 9. Pressure Control | Electric | |
| 10. Experimental Method | 1. Thermal resistance testing of the sample under different pressures, | |
| 2. Thermal conductivity testing of materials, | ||
| 3. Contact thermal resistance testing under different medium pressures, | ||
| 4. Thermal resistance testing of aluminum-based substrates (composite panels), | ||
| 5. Aging reliability testing, | ||
| 6. Thermal conductivity testing of high‑thermal‑conductivity materials (requires the optional high‑conductivity test module). | ||
| 7. Thermal contact resistance testing between specimens under different pressures (requires the optional thermal contact resistance test module). | ||
| 8. Material compression performance testing. | ||
| 11. Host Power Supply | Voltage: 220 V, 50 Hz; power rating less than 1 kW. |
Instrument configuration: one thermal conductivity meter host; one set of testing software (including communication interface); one constant-temperature bath (either a constant-temperature water bath or a constant-temperature oil bath, configured according to the selected temperature range) along with its control panel; and one desktop computer (which may be provided by the purchaser).
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Keywords:
SYA-32A Heat Flux Method Multifunctional Thermal Conductivity and Thermal Resistance Testing Instrument