LBMP-1 and 2P Precision Grinding and Polishing Machines
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Description
Product Introduction
The precision grinding and polishing machine is a next-generation device specifically designed for the lapping and polishing of metallic materials (metallographic specimens), ceramics, glass, rock samples, mineral samples, refractory materials, PCBs, composite materials, and sealing components. It is also suitable for processing optical elements, compound semiconductor substrates, ceramic wafers, sapphire, yttrium vanadate, lithium niobate, gallium arsenide, and other materials. This machine is equipped with a peach‑shaped hole‑type sample holder, further enhancing convenience when preparing metallographic specimens.
Key features:
This unit is equipped with a dispensing device that enables automatic dripping of grinding fluid. It features desktop mounting, stepless speed regulation, and digital display of rotational speed, ensuring convenient operation.
Technical specifications:
| Project | Parameter |
| Grinding disc speed | Stepless speed regulation, 20–600 rpm, grinding disc diameter: 203 mm |
| Workstation | One, two |
| Material tray diameter | 80mm |
| Drip bucket capacity | 0.85 liters |
| AC power supply | 220 volts |
| Main motor model | 90ZYT03 |
| Main motor power | 200 watts |
| Robotic arm | Adjustable |
| Tray-end skip/timing | 0.008/180mm, Timing: 0–99.99 |
| External dimensions | 820810760mm |
| Weight | 86kg |
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